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[Features]
· Because high strength is maintained even at high temperatures, work can be performed safely with minimal chip scatter.
· Demonstrates excellent cutting quality with instant bonding that fully retains the diamond granule cutting quality.
[Applications]
· For cutting concrete, secondary concrete products (e.g., U-shaped grooves), block, slate, ALC, stone, etc.
| Product Type | Diamond cutter | Wheel Type | Segment Type | Specifications | Dry Type |
|---|---|---|---|---|---|
| Application | For concrete, mortar / Stone Material | Outer Diameter(mm) | 304 | Blade thickness(mm) | 2.5 |
| Hole Diameter(mm) | 25.4 | Tip Height(mm) | 7.5 | Included ring bore diameter(mm) | 22・20 |
| Mass(g) | 1400 | Max. Rotational Speed(rpm) | 5000 | Trusco Code | 123-9431 |
| JAN Code | 4963202014977 | Base Metal Material | Special Steel | Chip Material | Diamond Abrasive Grain, Other |
| Ordering unit | 1 pc. |
Please check the type/dimensions/specifications of the part SL30525.4 in the Diamond Wheel Laser SL (Dry Type) series.

NAKAMURASEISAKU
Standard Price : MYR 1,249.80
Days to Ship : 12 Day(s) or more
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