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Release Vacuum Tweezers, Vacuum Tweezers Specifications
FURORO
Release vacuum pin set that is optimal for conveying small items that fall due to their own weight.
*The "FV-10" vacuum pump (sold separately) is required to use the pin set.
| Standard Price: | MYR 855.83- |
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| Days to Ship: | 8 Day(s) or more |

Vacuum Tweezers, Chemically Resistant, F Series
FURORO
The main unit of the vacuum pin set uses fluororesin (4F-PTFE/3F-PCTFE), and close excellent air-tightness and durability.
*To use tweezers, one of the vacuum pumps "FV-10," "FV-30," "FV-60" and "FV-XP" (sold separately) is required.
| Standard Price: | MYR 1,288.05- |
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| Days to Ship: | 8 Day(s) or more |

FURORO
Industry-first venting feature allows you to place a workpiece in a precise location without any impact.
*To use these tweezers, you will need either "FV-W" vacuum pump for F007 or the "FV-W-Conductive" vacuum pump for C007 (sold separately). Check the website for details.
| Standard Price: | MYR 1,132.46 |
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| Days to Ship: | 8 Day(s) or more |

Vacuum Release Tweezers, Application Nozzle
FURORO
A spare tip part for pick-and-release vacuum tweezers. [Features]Conductivity, chemical resistance, heat resistance, for minute objects
| Standard Price: | MYR 138.33 |
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| Days to Ship: | 8 Day(s) or more |

Vacuum Tweezers, Chemically Resistant, F Series, Adhesion Chip for Wafers
FURORO
The adhesion chip uses various resins (3F-PCTFE/PEEK/Vespel) with excellent chemical resistance, heat resistance, and mechanical strength.
| Standard Price: | MYR 570.55- |
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| Days to Ship: | 8 Day(s) or more |
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| Brand | FURORO | FURORO | FURORO | FURORO | FURORO |
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| Product Series | Vacuum Tweezers, Chemically Resistant, F Series, Adhesion Chip for Wafers | ||||
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| Days to Ship | 8 Day(s) or more | 8 Day(s) or more | 8 Day(s) or more | 8 Day(s) or more | 8 Day(s) or more |
| Type | Vacuum Tweezers | Vacuum Tweezers | Vacuum Tweezers | Vacuum Tweezers | Vacuum Tweezers |
| Application | For Transporting Small Objects | For Transporting Wafers | For Transporting Small Objects | For Transporting Small Objects | For Transporting Wafers |
| Part Structure | Body + Component Parts | Body + Component Parts | Body + Component Parts | Adsorption Part | Adsorption Part |
| Features | Electrical Conductivity / Heat Resistance | Chemical Resistance / Heat Resistance | Electrical Conductivity / Heat Resistance | Heat Resistance / Other Properties | Heat Resistance |
| Adsorption Part Material | Polyimide Composite | Polyimide Composite | Polyimide Composite | Polyimide Composite | Polyimide Composite |
| Arrival Suction Pressure (Gauge Pressure)(kPa) | - | - | - | - | - |
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