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MISUMI Heat Insulating Plates（Recommended Operating Temperature：Room Temp. ~ 300）
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- Recommendation
High Temperature Insulating Grade,Heat Resistance Within 300 °C
MISUMI
High Temperature Insulating Grade,Heat Resistance Within 300 °C
Heat Insulating Plates are an economy item, The price is cheaper than the MISUMI standard product.They offer a wide variety of sizes to choose from.
[Feature]
● Plate Thickness Minimum/Maximum (mm.): 3 and 30
● Width and Length (mm.) : Can configurable between 20 to 800 mm, and the minimum length can be increased by increments 1 mm.
● Operating Environment Temperature (℃) : Normal temperature～300
● Main Material : Phenolic Modified Resin
[Application]
It is used for thermal insulation of connecting parts and thermal insulation of flanges- RoHS
Days to Ship: 12 Day(s) -
Heat Insulating Plates/Free Cutting Grade/Thermal Plates
MISUMI
Heat Insulating Plates/Free Cutting Grade/Thermal Plates
Heat insulating plates are used for various purposes to manage and control heat transfer in different applications. They offer a wide variety of sizes to choose from.
[Feature]
● Plate Thickness (mm.): 12.7, 19.1 and 25.4
● Operating Environment Temperature (℃) :
Free Cutting Grade (White Gray) - Room Temp. ~ 300
Thermal Grade (Gray) - Room Temp. ~ 350
● Plate Type : Standard (No holes)/ Plate with Holes (2/4/6 holes)
[Application]
It is used for thermal insulation of connecting parts and thermal insulation of flangesDays to Ship: 5 Day(s) or more -
High Strength and High Temperature Insulating Grade, Heat Resistance Within 300 °C
MISUMI
High Strength and High Temperature Insulating Grade, Heat Resistance Within 300 °C
Heat Insulating Plates are an economy item, The price is cheaper than the MISUMI standard product.They offer a wide variety of sizes to choose from.
[Feature]
● Plate Thickness Minimum/Maximum (mm.): 3 and 30
● Width and Length (mm.) : Can configurable between 20 to 800 mm, and the minimum length can be increased by increments 1 mm.
● Operating Environment Temperature (℃) : Normal temperature～300
● Main Material : PI-modified resin
[Application]
It is used for thermal insulation of connecting parts and thermal insulation of flanges- RoHS
Days to Ship: 12 Day(s)
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| Product Series |
| CAD |
| Days to Ship |
| Specifications |
| Recommended Operating Temperature(°C) |
| Environmentally Friendly(mm) |
| Plate Thickness T(mm) |
| Width B(mm) |
| Length A(mm) |
| Application |
| Number of Holes |
| A/B Dimension Tolerance |
| Thermal Conductivity *Insulation: Low > High(W/m･k) |
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| Brand | MISUMI | MISUMI | MISUMI |
| Product Series | High Temperature Insulating Grade,Heat Resistance Within 300 °C | High Strength and High Temperature Insulating Grade, Heat Resistance Within 300 °C | |
| CAD |
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| Days to Ship | 12 Day(s) | 5 Day(s) or more | 12 Day(s) |
| Specifications |
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| |
| Recommended Operating Temperature(°C) | Room Temp. ~ 300 | Room Temp. ~ 300 | Room Temp. ~ 300 |
| Environmentally Friendly(mm) | - | - | - |
| Plate Thickness T(mm) | 3 ～ 30 | 5 ～ 15 | 3 ～ 30 |
| Width B(mm) | 20 ～ 800 | 20 ～ 600 | 20 ～ 800 |
| Length A(mm) | 20 ～ 800 | 20 ～ 800 | 20 ～ 800 |
| Application | - | Free-cutting | - |
| Number of Holes | - | - | - |
| A/B Dimension Tolerance | - | - | - |
| Thermal Conductivity *Insulation: Low > High(W/m･k) | - | - | - |
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Configure
Specification/Dimensions
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Recommended Operating Temperature(°C)
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Environmentally Friendly(mm)
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Plate Thickness T(mm)
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Width B(mm)
[20-800/1mm Unit(s)]
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Length A(mm)
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Application
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Number of Holes
- No Hole Processing
- 2 Holes
- 4 Holes
- 6 Holes
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A/B Dimension Tolerance
- ±0.3
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Thermal Conductivity *Insulation: Low > High(W/m･k)
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