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High Strength and High Temperature Heat Insulating Plates, Heat Resistance Within 400°C (Part Numbers)

Product Overview
The thermal insulation board is a heat-resistant laminated board made from skeletal glass fiber and high heat-resistant composite materials. It is asbestos-free, provides excellent thermal insulation, has low thermal conductivity and low specific gravity, making it a lightweight board with outstanding thermal insulation and heat preservation properties.
It effectively prevents heat diffusion, improves energy efficiency, ensures even heat distribution, and protects surrounding components such as bearings and sensors, helping to prevent thermal deformation and other related issues.
Dimensional Drawing
■ Standard type ■ Hole processing type
Detailed specification and dimension diagram of MISUMI insulator plates High temperature insulator plates High insulating grade Low thermal conductivity grade Insulation
A ≥ B
Material Specifications
TypeTolerance SelectionA·B Dimension ToleranceMain Base MaterialMain MaterialGradeColorOperating Ambient Temperature
E-HIPSANot Specified+1.0
0
Glass fiberSilicate adhesiveHigh temperature and high durability gradeWhite-80°C to 400°C
P±0.3
Specification Table
■ Standard type
TypeSpecified unit: 1 mmThickness
Select T
TypeTolerance SelectionDimensional ToleranceLength AWidth B
A ≥ B
E-HIPSANot SpecifiedA, B: (+1.0, 0)
T: ±0.1
20–80020–8003
5
10
15
20
25
30
PA, B: ±0.3
T: ±0.05
20–30020–3003
5
10
15
20
25
30

■ Hole processing type
TypeSpecified Unit: 1 mmThickness
Select T
Specify Unit: 0.5 mmHole Shape Selection
TypeTolerance SelectionDimensional ToleranceNumber of HolesLength AWidth BFGNZ
A ≥ B
E-HIPSANot SpecifiedA, B: (+1.0, 0)
T: ±0.1
2H
4H
20–80020–80039–7915–795
(2H)

9–791
(4H)
3
4
5
6
8
10
5
104 5 6
154 5 6 8
204 5 6 8
254 5 6 8
304 5 6 8
PA, B: ±0.3
T: ±0.05
20–30020–30039–2915–295
(2H)

9–291
(4H)
5
104 5 6
154 5 6 8
204 5 6 8
254 5 6 8
304 5 6 8

The specified range for dimension F must satisfy: d (d1) + 5 ≤ F ≤ A - d (d1) - 5.
When selecting type 2H, the specified range for dimension G must satisfy: d (d1)/2 + 2.5 ≤ G ≤ B - d (d1)/2 - 2.5. When selecting type 4H,
 it must satisfy: d (d1) + 5 ≤ G ≤ B - d (d1) - 5. (When d is selected for through holes and d1 is selected for counterbored holes)
When selecting a type with hole machining, please choose N (through hole) or Z (counterbore).  
Detailed Drawing of Hole Machining
N (Through Hole)Z (Counterbore)
Standard type insulator plate size specification table and detailed specificationsStandard type insulator plate size specification table and detailed specifications
Nominal Bolt Diameter3456810
d3.54.55.56.5911
d1-89.51114-
h-5679-
Product Features
Feature 1: The insulation board material is a heat-resistant laminate and does not contain asbestos.
Feature 2: The high-strength insulation board has high compressive and flexural strength, making it most suitable for applications requiring higher strength.
Feature 3: The high-temperature insulation board has low thermal expansion at high temperatures, maintains compressive strength under high heat, is minimally deformed under pressure, and remains dimensionally stable during prolonged exposure to high temperatures.
Feature 4: Available in standard and machined hole types to meet different requirements.
Feature 5: The insulation board product line is extensive, meeting various high-temperature and thermal conductivity needs.
Feature 6: All products remain dimensionally stable and do not deform when heated within their operating temperature range, providing excellent insulation performance.
Precautions
(1) Usage precautions:
· When using bolts, be sure to use washers at the same time; otherwise, excessive tightening may cause cracking. (Figure A)
· Do not use in environments exposed to water or chemicals. Insulation boards containing moisture may crack or experience significant performance degradation when the temperature rises.
· Since this is a laminated molded product, do not apply force in the lamination (splitting) direction during use.
· Using at certain heating temperatures may produce a slight odor, which is not harmful, but please ensure proper ventilation, keep your face away, and handle as you would with ordinary smoke.
(2) Precautions for processing:
· When processing, please use a vacuum cleaner or similar device to collect dust and prevent it from spreading. (Figure B)
Although it does not contain asbestos or other specific chemicals, standard dust safety measures such as wearing a mask and protective goggles are required.
Additionally, since this product contains glass fibers, it may cause skin irritation. It is recommended to wear gloves when handling. If dust adheres to sliding parts of other processing machines, it may cause wear and reduce the machine's precision.
· When drilling or making holes, cracking may occur, so please pay close attention to hole spacing, hole diameter, processing conditions, and other factors.
· Laminated molded products are not suitable for threading, three-dimensional machining, etc. Drilling, cutting, and other processing along the lamination direction are the main causes of cracking, so please avoid such operations as much as possible. (Figure C)
When using bolts with insulation boards, be sure to use washers at the same time. When processing, please use a vacuum cleaner or similar device to collect dust.

■ Recommended processing conditions for heat insulation boards
Recommended processing conditions for insulation boards (for reference)
Example of Use
Example of Use 1Product Function
MISUMI insulation boards are used for effective insulation inside furnaces.Used for thermal insulation at connector locations
Example of Use 2Product Function
Using MISUMI insulation boards as cover plates can effectively achieve insulation.Thermal insulation for flange sections
Application Industries
Electronics Automotive
Widely used in the manufacturing of electronic and electrical products, with high acceptance. Shafts for urethane mold bearing Commonly used in the automotive industry and other industrial fields such as automobile manufacturing. Engineering plastics bearing
Smartphones Semiconductors
Widely used in fields such as smartphones and well received by the public. Guide rollers Widely used and highly praised in the semiconductor industry, semiconductor field, and semiconductor equipment. Conveyor rollers, press wheels with bearings type
Related Products
Related Documents
Precautions for Using Insulation Boards  Click here

Part Number 

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Part Number
E-HIPSA2H-[20-800/1]-[20-800/1]-[3,​5,​10,​15,​20,​25,​30]-F[9-791/0.5]-G[5-795/0.5]-N[3,​4,​5,​6,​8,​10]
E-HIPSA2H-[20-800/1]-[20-800/1]-[3,​5,​10,​15,​20,​25,​30]-F[9-791/0.5]-G[5-795/0.5]-Z[4,​5,​6,​8]
E-HIPSA4H-[20-800/1]-[20-800/1]-[3,​5,​10,​15,​20,​25,​30]-F[9-791/0.5]-G[9-791/0.5]-N[3,​4,​5,​6,​8,​10]
E-HIPSA4H-[20-800/1]-[20-800/1]-[3,​5,​10,​15,​20,​25,​30]-F[9-791/0.5]-G[9-791/0.5]-Z[4,​5,​6,​8]
E-HIPSA-[20-800/1]-[20-800/1]-[3,​5,​10,​15,​20,​25,​30]
E-HIPSAP2H-[20-300/1]-[20-300/1]-[3,​5,​10,​15,​20,​25,​30]-F[9-291/0.5]-G[5-295/0.5]-N[3,​4,​5,​6,​8,​10]
E-HIPSAP2H-[20-300/1]-[20-300/1]-[3,​5,​10,​15,​20,​25,​30]-F[9-291/0.5]-G[5-295/0.5]-Z[4,​5,​6,​8]
E-HIPSAP4H-[20-300/1]-[20-300/1]-[3,​5,​10,​15,​20,​25,​30]-F[9-291/0.5]-G[9-291/0.5]-N[3,​4,​5,​6,​8,​10]
E-HIPSAP4H-[20-300/1]-[20-300/1]-[3,​5,​10,​15,​20,​25,​30]-F[9-291/0.5]-G[9-291/0.5]-Z[4,​5,​6,​8]
E-HIPSAP-[20-300/1]-[20-300/1]-[3,​5,​10,​15,​20,​25,​30]
Part NumberStandard Unit PriceMinimum order quantityVolume DiscountDays to ShipPlate Thickness T
(mm)
Width B
(mm)
Length A
(mm)
Selection Tolerance Number of Holes Hole Machining Counterbore (Bolt Nominal Diameter) [Z] Through Hole (Bolt Nominal Diameter) [N] F
(mm)
G
(mm)

-

1 Piece(s) 12 Day(s) 3 ~ 3020 ~ 80020 ~ 800Not Specified2H (2 holes)With Hole Machining-39 ~ 7915 ~ 795

-

1 Piece(s) 12 Day(s) 3 ~ 3020 ~ 80020 ~ 800Not Specified2H (2 holes)With Hole Machining4 ~ 8-9 ~ 7915 ~ 795

-

1 Piece(s) 12 Day(s) 3 ~ 3020 ~ 80020 ~ 800Not Specified4H (4 holes)With Hole Machining-39 ~ 7919 ~ 791

-

1 Piece(s) 12 Day(s) 3 ~ 3020 ~ 80020 ~ 800Not Specified4H (4 holes)With Hole Machining4 ~ 8-9 ~ 7919 ~ 791

-

1 Piece(s) 12 Day(s) 3 ~ 3020 ~ 80020 ~ 800Not Specified-Without Hole Machining----

-

1 Piece(s) 12 Day(s) 3 ~ 3020 ~ 30020 ~ 300Specified Tolerance P2H (2 holes)With Hole Machining-39 ~ 2915 ~ 295

-

1 Piece(s) 12 Day(s) 3 ~ 3020 ~ 30020 ~ 300Specified Tolerance P2H (2 holes)With Hole Machining4 ~ 8-9 ~ 2915 ~ 295

-

1 Piece(s) 12 Day(s) 3 ~ 3020 ~ 30020 ~ 300Specified Tolerance P4H (4 holes)With Hole Machining-39 ~ 2919 ~ 291

-

1 Piece(s) 12 Day(s) 3 ~ 3020 ~ 30020 ~ 300Specified Tolerance P4H (4 holes)With Hole Machining4 ~ 8-9 ~ 2919 ~ 291

-

1 Piece(s) 12 Day(s) 3 ~ 3020 ~ 30020 ~ 300Specified Tolerance P-Without Hole Machining----

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Basic Information

Recommended Operating Temperature(°C) -80~400 Application High Temperature Resistant / High Strength / High Temperature Resistant Grade High temperature and high durability type
Color White Shape Plate (Raw Material Sheet) Thermal Conductivity(W/m·K) 0.24
Expansion Rate(℃-1) 0.000028 Main Material Silicate adhesive

Frequently asked question (FAQ)

Question: What could be the reason if the thermal insulation board you purchased does not seem to provide good insulation?
Answer: The thermal insulation performance of the insulation board is related to its thermal conductivity and thickness. The lower the thermal conductivity and the greater the thickness, the better the insulation effect. It is also related to the operating conditions in which the insulation board is used (whether it is suitable or not).
Question: Is the operating temperature of the thermal insulation board a guaranteed value?
Answer: The recommended operating temperature of the insulation board refers to the temperature at which, after long-term use for a certain period, the quality will not deteriorate rapidly.
Question: Can I perform additional processing on a MISUMI thermal insulation board after purchase?
Answer: Yes. However, be sure to refer to the processing precautions and thermal insulation board processing conditions in the notes. In addition, it is recommended to ensure that the distance from the hole to the edge of the material leaves at least 5 mm of material thickness.
Question: What are the major differences between the materials of the economical thermal insulation board and the imported thermal insulation board?
Answer: The economical thermal insulation board uses domestically produced materials that have been thoroughly evaluated for performance, offering quality close to imported thermal insulation boards but with a better cost-performance ratio.

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